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UV laser marking machine is mainly used for all kinds of glass, Charger shell of Samsung and Iphone, earphone, TFT, LCD, plasma screens, textiles, thin ceramic Silicon, IC Crystal, Sapphire, polymers, drug, cosmetic, polymer materials such as wire, bottles(boxes)surface marking, and micro-holes...
Applications:
Mainly designed for sensitive materials to heat. UV laser will performs well in marking and engraving. For 355nm wavelength UV laser, in theory, it can work nearly all kinds of materials. Most widely applied.
UV laser is well know for glass laser engraving, ABS plastic laser marking, and IC products.
Technical specifications
| Plastic engraving laser machine |
355nm 3w 5w UV Laser Marking Machine for ABS Plastic Case |
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| Mode of operation | Pulsed | |||
| Polarization | random | |||
| Nominal average output power | 3W - 5W | |||
| Central emission wavelength | 355 nm ,Q-switched operation | |||
| Emission Bandwidth (FWHM) | <10 nm | |||
| Average power instability | <5% | |||
| Pulse width, (FWHM) | 100 ns | |||
| Laser switching ON time | 180 μsec | |||
| Laser switching OFF time | 180 μsec | |||
| Pulse Repetition Rate* kHz | 20-80 kHz | |||
| Energy per pulse (PRR = 20 kHz) | 0.95 mJ | |||
| Typical beam quality, M2 | <1.8 | |||
| Output fiber delivery length | 3m | |||
| Operating voltage | 220V | |||
| Max. Power consumption | 600W | |||
| Dimensions | 75*85*145cm | |||
| Net Weight | 130 kgs | |||
| Gross Weight | 150 kgs | |||
| Scanning Speed | 0-10000mm/s | |||
| Marking Speed | 0-10000mm/s | |||
| Marking size | 110mm×110mm (F-theta 160) | |||
| Spot size | ≤ 40 micron (F-theta 160) | |||
| Cooling unit | Water cooled | |||
| Pilot laser | 650nm diode laser, visible red light for marking guide | |||
| Continuous working time | ≤16h | |||
| Humidity | 45~85% (no condensation) | |||
| Operating temperature | 0~45°C | |||
| Control units | EZCAD (English Version) | |||
